After repeated tests, the automatic degumming machine produced by our company has been more prominent in the products of the same industry. This equipment is suitable for the degumming treatment of silicon wafer after wire cutting, silicon rod length "555 mm wire cutting, unique process path, ensure that silicon wafer degumming thoroughly clean, trolley loading and unloading, facilitate the turnover of silicon wafer and tooling, and handle 3-6 wire cutting silicon rods without an hour.

The main production lines of automatic degumming machine are as follows: feeding, spray cleaning tank, spray cleaning tank, ultrasonic cleaning tank, ultrasonic cleaning tank, pickling degumming tank, pickling degumming tank, cutting material. The working principle is to use the mechanical vibration with strong ultrasonic permeability to impact the workpiece surface and combine the chemical action of weak acid to make the silicon wafer degumming. The key parts of the electrical control part of the equipment are imported high-quality parts, reliable performance, long service life, this equipment uses a gantry car to clean the operation, smooth and reliable action.